Product
NEMST-D2002H 系列
Horizontal Plasma Desmear Machine (Standard Type,10PCS)


- Unique Plasma Technology integrated with Inductively Coupling Plasma (ICP) and Hollow Cathode Plasma (HCP) design.
- ICP & HCP are generated at the same time and it can substantially increase the plasma density as well as the process speed.
- By employing water-cooling electrodes, the resistance of the electrode surface can remain the same, increasing the process stability. Multiple Processing Gas Selectivity. Multiple Easy-Maintenance and Low-Maintenance-Cost Designs.
- High Automation and Operator Friendly Design.
- The machine can be produced in customized designs depending on the customer's requirements.
- Stepwise processing is available.
- Convenient Cart/Rack Loading/Unloading Designs.
- Very low processing temperature and thus decreases the risk of damage on the products and increases the reliability of the processes. High Plasma Desmear Uniformity.
- Very High Plasma Desmear Efficiency.
- Multiple Process Gases Selectivity (CF4, O2, N2, Ar, H2 and etc.) to achieve the best surface treatment effects.
- High Capability (14/28 panels, 510 mm x 610 mm or 56/112 panels, 200 mm x 250 mm / Rigid, Flex, Rigid-Flex Boards).
- Etching / Desmear / Descum / Cleaning. Blind Vias and Through Holes Plasma Treatment. Interlayer Adhesion Promotion.
- Resist / Emulsion Removal.
- Surface Activation / Surface Roughness Improvement / Surface Modification.